Sovereign Silicon Integrity Audit

Independent, offline audits identifying hidden reliability risks in advanced silicon systems operating at physical limits.

Reliability Audit

Independent black-box analysis of silicon platforms under real electrical, thermal, and power stress to identify latent failure mechanisms and lifetime risk margins.

Close-up of a silicon chip under thermal imaging highlighting stress points.
Close-up of a silicon chip under thermal imaging highlighting stress points.
System-Level Analysis

Cross-domain evaluation of power delivery, thermal behavior, and aging interactions that are not visible through isolated design or monitoring tools.

Clear, actionable findings that support engineering and executive decisions without modifying designs, exposing IP, or altering validation workflows.

Decision Support

3D-IC architecture model showing power and thermal interaction zones.
3D-IC architecture model showing power and thermal interaction zones.

Deep Insight into Silicon Failure Mechanisms

Independent identification of latent failure mechanisms under real electrical and thermal stress.

Close-up of a silicon chip under thermal imaging highlighting stress points.
Close-up of a silicon chip under thermal imaging highlighting stress points.
System Audits

Our audits expose cross-domain interactions between power delivery, thermal behavior, and cumulative aging that drive latent failures in AI accelerators and advanced SoCs.

Engineer analyzing a 3D-IC architecture on multiple monitors with thermal and power data overlays.
Engineer analyzing a 3D-IC architecture on multiple monitors with thermal and power data overlays.

Deep Insight into Silicon Failure Mechanisms

ndependent identification of latent failure modes under real-world operating envelopes.
We quantify system-level risk without requiring source code access, design disclosure, or hardware modification.

Focused on System-Level Semiconductor Reliability

QH8 Technologies conducts independent, offline reliability audits of advanced silicon systems operating under real-world electrical, thermal, and mechanical stress.

Our work reveals cross-domain failure mechanisms that are not visible through conventional simulation, monitoring, or point-tool analysis.

1. Observe Real Behavior

We analyze silicon platforms under real electrical, thermal, and workload stress, capturing behaviors that do not appear in simulations or isolated lab tests.

2. Correlate Across Domains

We correlate power delivery, thermal dynamics, aging effects, and workload history to expose cross-domain interactions that drive latent failure modes.

3. Deliver Actionable Risk Clarity

Findings are delivered as clear, decision-grade insights—without requiring source code access, hardware modification, or changes to existing validation workflows.

Close-up of a silicon chip under thermal imaging highlighting stress points.
Close-up of a silicon chip under thermal imaging highlighting stress points.